Inspection process
Visual Inspection
Inspect the IC for signs of refurbishment (tin plating), re-marking, and ensure that the dimensions and appearance align with the specification sheet, as well as the overall external condition of the IC.
X-ray Inspection
Inspect the internal wire bonding and the integrity of the wafer.
Functional/Electrical Test
Test the IC's primary or partial performance against the specification document's test conditions to ensure it falls within the specified range. Specific test parameters or items are subject to the quotation.
XRF
Lead/Lead-Free Analysis
Heated Chemical Test
Chemical wipe test to detect if the material has been re-printed (AS6081 required test items)
Solderability Test Solderability Testing
[Two methods available: Immersion Tin Test and Reflow Soldering Test] to verify that the solder coverage rate on the component leads reaches 95%
Decapsulation (Dismantling) Test
Inspect the original manufacturer's logo and markings on the wafer inside the IC to confirm authenticity. If no logo is present, an original sample must be provided for comparison
Cross-section test
Mainly used for authenticity verification of passive components (resistance, capacitance, inductance). Authenticity is confirmed by comparing the internal structure with a gold sample. For capacitors, the number of electrode layers, electrode layer thickness, protective layer thickness, and dielectric layer thickness are examined; for inductors, the number of coil turns, wire diameter, winding method, and presence of a magnetic core are examined.Secondly, failure analysis requires slicing tests to perform point-by-point slicing on the material.
Programming and burning
Part of performance testing, this process involves loading specific program code or data into an integrated circuit chip (typically a microcontroller or memory chip), primarily to verify whether MCUs and memory chips can be programmed and burned normally.
Aging Test
Predicts the service life of a product, evaluates or predicts the durability of products manufactured by the manufacturer, eliminates defective products, and avoids waste of packaging costs.
Ultrasonic Scanning
Ultrasonic scanning can be used to detect structural defects such as layering, cracks, and gas pockets at different locations inside a chip. It is an important non-destructive analysis method in failure analysis and also one of the key testing methods in reliability projects to detect quality issues.
Scanning Electron Microscopy (SEM)
SEM is a method that uses a focused electron beam to scan the surface of a sample. By detecting signals generated by the interaction of electrons with the sample, it observes and analyzes the composition, morphology, and structure of the sample surface. This is primarily achieved through secondary electrons, backscattered electrons, and characteristic X-ray signals to analyze the surface properties of the sample.
Failure Analysis
Failure analysis is a systematic study of faulty or failed components using specialized technical methods. It primarily analyzes the specific causes of failure in electronic components and assemblies during operation, why they fail to meet performance expectations, and their potential performance in their intended final applications. Examples include PCBA solder joint cracking, chip burnout, and circuit short circuits.