Quality Assurance
For over a decade, QCA TECH LIMITED has been committed to supplying new and original electronic components with uncompromising quality and reliable service. Backed by our dedicated Quality Control Department and state-of-the-art testing equipment, we ensure every product meets the highest standards before shipment.
Testing Process
Inspect the IC to determine whether it has been remanufactured (re-tinned) or re-marked, whether its dimensions and form factor match the specifications, and assess the IC’s external condition.
Testing is conducted in accordance with the specifications to verify whether the IC’s primary or partial performance characteristics fall within the specified range; specific test parameters or items are subject to the quotation
To verify whether the material has been re-marked (a test item required by AS6081)
[Two methods: tin immersion test and reflow soldering test] To verify whether the solder coverage rate on the material’s leads reaches 95%
Inspect the original manufacturer’s logo and markings on the IC’s internal wafer to confirm whether it was produced by the original manufacturer. If no logo is present, an original sample is required for comparison
Primarily used for authenticity verification of passive components (resistors, capacitors, inductors). Authenticity is confirmed by comparing the internal structure with a gold standard sample. For capacitors, the focus is on the number of electrode layers, electrode layer thickness, protective layer thickness, and dielectric layer thickness; For inductors, the focus is on the number of coil turns, wire gauge, winding method, and the presence or absence of a magnetic core; secondarily, failure analysis requires cross-section testing, involving cross-sectioning along the leads of the component.
Part of performance testing, this is the process of loading specific program code or data into an integrated circuit chip (typically a microcontroller or memory chip), primarily to verify whether MCUs and memory chips can be programmed and burned normally.
This test predicts the product’s service life, evaluates or forecasts the durability of the manufacturer’s products, eliminates defective products, and prevents waste of packaging costs.
Ultrasonic scanning can be used to detect structural defects such as delamination, cracks, and voids at various locations within the chip. It is one of the key non-destructive analysis methods in failure analysis and also serves as a vital testing method for identifying quality issues in reliability programs.
A scanning electron microscope (SEM) is a method that uses a focused electron beam to scan the surface of a sample. By detecting the signals generated when electrons interact with the sample, it observes and analyzes the composition, morphology, and structure of the sample’s surface. It primarily analyzes the surface characteristics of the sample through secondary electrons, backscattered electrons, and characteristic X-ray signals.
Failure analysis involves the systematic investigation of faulty or failed components using specialized technical methods. It primarily analyzes the specific causes of failure in electronic parts and assemblies during operation, examines why they fail to meet performance expectations, and assesses their potential performance in their intended end-use applications. Examples include PCBA solder joint cracking, chip burnout, and circuit short circuits.
